• Startseite
• 2.5d
• 2.5D vs. 3D Packaging, Advanced PCB Design Blog

2.5D vs. 3D Packaging, Advanced PCB Design Blog

4.7 (777) · € 26.99 · Auf Lager

Advanced packaging - from 2D, 3D to 4D packaging - IBE Electronics

What is 2D, 2.5D & 3D Packaging of Integrated Chips? - techovedas

Design Technologies for Advanced Packaging

Semiconductor Packaging (3D IC) Emerging As Innovation Enabler! - SemiWiki

IC packaging design & verification

The growth of advanced semiconductor packaging

Interposers - Semiconductor Engineering

IC Packaging Design & Verification Resource Library

Capturing connectivity for assembly verification in 2.5D and 3D design

The Era of Chiplets and Heterogeneous Integration - SemiWiki

Building confidence and flexibility in 3D-IC system level design

ESD protection for 2.5D and 3D packages – SOFICS – Solutions for ICs

Conquering 2.5D and 3D Chip Design Challenges with Monozukuri

IC Packaging Solutions